Products

Vision machines & inspection systems

From wafer handling to micro-optics inspection: the AV and PI-1000 machine lines, plus deep-learning AI vision for defects rules can't define.

AV9000 Amethyst micro-optics inspection machine, door open
A deep-learning model learns from good and defective images, then highlights a crack on a textured part

New · AI Vision

AI vision inspection

Deep learning that learns what "good" looks like from your sample images, for defects too variable for rule-based vision.

Learnsfrom good & bad images
Adaptsto texture & variation
Classifiesdefects by type
  • Cosmetic defects
  • Surface anomalies
  • Defect classification
  • Assembly verification
  • Difficult OCR

Rule-based vision

  • Precise measurement & gauging
  • Fixed, well-defined features
  • Barcodes & 2D codes
  • Robot guidance

AI vision

  • Defects that vary in shape & size
  • Natural or textured surfaces
  • Judgements that are hard to put into rules
  • Sorting defects into classes

Most lines get the best result by combining both, and we'll recommend the right mix for yours.

AV1000WL

Wafer loader

A flexible robotic module that automates wafer and tray loading, with vision guidance to protect every wafer it handles.

<50 seccycle time per wafer
8″ & belowwafer, or tray
>168 hrsmean time between failure
  • Recipe-driven
  • Cassette mapping
  • Cross-slot protection
  • Touch-screen
  • Customisable end effector

Recipe-driven operation automates loading and unloading for maximum uptime, while cassette mapping and cross-slotted wafer detection protect wafers automatically. The modular design and user-configurable controls make it easy to reconfigure, repair and maintain.

Download the AV1000WL brochure (PDF)
SpecificationAV1000WL
Machine dimensions (W × D × H)731 × 1420 × 1720 mm
Machine weight250 kg
Utilities200–240 VAC, 50/60 Hz, 3 kW
Compressed air6 bar
Wafer size8″ or tray
Load portSingle metal frame, or dual tray
Cycle timeBelow 50 sec per wafer
Uptime> 95%
Mean time between assist< 2 hrs
Mean time between failure> 168 hrs
Door open detection / failure mapping / defect logging / barcode scanningStandard
2D matrix scanning / OCROptional (sample part needed)
Operating systemPC, Windows

AV9000 · Amethyst

Micro-optics inspection

A high-speed, high-accuracy machine for inspecting cell phone camera lenses, built to eliminate the underkill and overkill that human inspectors struggle with.

3.5 µmpixel resolution
500defect images logged
8 typesprogrammable defect criteria
  • Bubble
  • Void
  • Offset
  • Stain
  • Chipping
  • Adhesive stain
  • Scratch
  • Saw dust

Special optics reduce the reflection issues caused by a lens's undulating contour, and every defect specification and consecutive-failure rule is individually user-settable. Handles die sizes from 1.5 to 6 mm and package heights up to 12 mm.

Download the AV9000 brochure (PDF)
Optics modelAmethyst C1x-4MAmethyst C1.5x-4MAmethyst C2x-4M
Lens magnification1×1.5×2×
Field of view11.3 × 11.3 mm7.5 × 7.5 mm5.65 × 5.65 mm
Resolution5.5 µm/pixel3.7 µm/pixel2.7 µm/pixel
Accuracy (2D)11.0 µm7.4 µm5.5 µm
SpecificationAV9000
Machine dimensions (W × D × H)1800 × 1800 × 2200 mm
Machine weight~350 kg
Utilities200–240 VAC, 50/60 Hz, 3 kW
Compressed air6 bar
Vibration criteriaVC-E (0.003 mm/s)
Camera4 MP, monochrome
LightingMulti-channel, multi-colour
Uptime> 95%
Mean time between assist< 2 hrs
Mean time between failure> 168 hrs
Door open detection / failure mapping / defect logging (incl. image) / barcode scanningStandard
2D matrix scanning / OCROptional (sample part needed)
Operating systemWindows 7 or later
OptionsCustom lens / working distance, PC or rackmount enclosure, special adaptations

PI-1000M

Mark inspection

High-speed, PC-based mark inspection that classifies each defect type.

Classifiesdefects by type
Per-defecttolerance settings
+ Orientation& missing unit
  • Missing character
  • Wrong character
  • Blurred
  • Scratched
  • Misaligned

PI-1000ML

Lead inspection (in-tape)

Final inspection of 2D SOIC leads, mark and orientation inside the carrier-tape pocket.

In-tapefinal inspection
3-in-1lead, mark, orientation
Anti-glareoptics for tape & body
  • Lead position
  • Pitch & span
  • Bent leads
  • Shiny-lead option

PI-1000B

2D BGA inspection

Measures 2D ball grid arrays with simple set-up and easy calibration.

2,000solder balls per second
10defect images logged
3 typesBGA · CSP · flip chip
  • Missing ball
  • Ball position
  • Ball size
  • Pitch

PI-1000T

Trim inspection station

Non-contact, high-speed monitoring of IC, lead and dambar after trim.

Sliverseven subtle defects
Front + backlighting options
I/Oeasy line integration
  • Dambar
  • Lead
  • IC body
  • Pre-stored packages

Need a different check?

See what we've built for other manufacturers.

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